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EIZO Releases High-Performance, Low-Power Embedded XMC AI/GPGPU Processing Card Based on NVIDIA RTX Technology

Image of the Condor NVA500xX XMC video graphics and GPGPU processing card
Condor NVA500xX
  • EIZO’s Condor NVA500xX XMC card utilizes the NVIDIA RTX A500 GPU, featuring 4 GB GDDR6 video graphics memory and support for AI-accelerated GPU computing.

Orlando, Florida. – December 6th, 2023 – EIZO Rugged Solutions Inc., a provider of ruggedized graphics and video products, has introduced the Condor™ NVA500xX – a high-performance XMC form factor AI/GPGPU card designed for compute-intensive processing applications in high-performance embedded computing (HPEC) systems. 

The Condor NVA500xX is designed with the NVIDIA RTX A500 GPU (Ampere architecture), which supports 4 GB GDDR6 video graphics memory, 2,048 NVIDIA CUDA cores, 16 RT Cores (2nd generation), and 64 Tensor Cores (3rd generation). This solution also supports PCI Express Gen 4, along with dedicated H.265/H.264 encode and decode engines for real-time ISR data collection, processing, analysis, and compressed streaming. 

These capabilities enable seamless data processing from multiple sensors and utilize machine learning to provide immediate, actionable intelligence for mission-critical applications. This XMC GPGPU solution is ideal for C5ISR applications involving low-latency data processing, at-the-edge computing, digital signal processing (DSP), signal intelligence (SIGINT), and other high-performance EW processing payloads.

John Payne, Senior Product Manager at EIZO Rugged Solutions, said, “The NVIDIA RTX A500 is a headless GPU that offers the embedded defense market a unique processing solution with ideal power/performance balance and AI/ML capabilities. With no video outputs, the XMC coprocessor allocates the full capacity of the GPU to focus solely on inference and other complex GPGPU operations.”

He added, “The Condor NVA500xX XMC card enables SWaP-C-constrained systems a path forward to enabling AI/ML pipelines.”

The Condor NVA500xX is offered in conduction-cooled or air-cooled configurations and is designed to meet MIL-STD-810 for defense and aerospace environmental specifications, all of which are designed and manufactured in the USA.