Condor AGX-ORIN64-HPC

Condor AGX-IOX
Sensor Open System Architecture

High-Performance Embedded Computing

NVIDIA® Jetson AGX Orin™ supporting NVIDIA Ampere Architecture with 2048 NVIDIA CUDA® cores and 64 Tensor Cores

Rugged Single Board Computer

Designed with GPU & CPU compute capabilities with AI inferencing, deep learning, and dedicated Codec engines

High-Speed Data Transfer

Support for NVIDIA ConnectX-7 SmartNIC, PCIe Gen 4, and NVIDIA GPUDirect® RDMA

Condor AGX-ORIN64-HPC

Embedded 3U VPX SBC with NVIDIA Jetson AGX Orin 64GB

The Condor™ AGX-ORIN64-HPC is a rugged 3U VPX high-performance single board computer (SBC) designed for both autonomous and embedded edge computing systems. The Condor AGX-ORIN64-HPC uses the NVIDIA Jetson AGX Orin 64GB (Industrial) SoM that hosts an NVIDIA Ampere architecture GPU and a 12-core Arm® Cortex®-A78AE CPU. The module’s 64GB of LPDDR5 system memory allows up to 205 GB/s memory bandwidth shared between the internal CPU, GPU, and accelerator engines.

SOSA-Aligned SBC with Advanced Storage and Networking

The Condor AGX-ORIN64-HPC incorporates the NVIDIA ConnectX®-7 NIC, enabling high-speed data transfer of up to 100Gb/s and 25Gb/s using Gigabit Ethernet. This, along with NVIDIA GPUDirect® RDMA over converged Ethernet (RoCE), enables high-speed communication between distributed sensors, RF transceivers, and platforms. In addition, the card supports 64 GB eMMC internal storage, an M.2 2230 site for expandable storage, and features high-speed I/O such as USB 3.2, DisplayPort™, and RS-232 Serial. The NVIDIA® Jetson AGX Orin™ SoM features HEVC (H.265)/AVC (H.264) NVENC and NVDEC engines with support for up to 4K-UHD encode resolution. The Condor AGX-ORIN64-HPC is designed to support both VITA 46/65 and the Sensor Open System Architecture (SOSA™) technical standards slot profile 14.6.11.

Condor AGX-ORIN64-HPC Block Diagram
Condor AGX-ORIN64-HPC Block Diagram

Product Specifications

Graphics ProcessorNVIDIA® Jetson AGX Orin™ Industrial
Interface3U VPX
14.6.11 Compute-Intensive Slot Profile Support
1.0” Pitch (Conduction Cooled)
IPMIDual IPMB
Tier 1 and Tier 2 Supported
Multiple temperature and voltage sensors
CPU12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
3MB L2 + 6MB L3 2048-core
2.2GHz
GPU2048-core NVIDIA Ampere architecture GPU
64 Tensor Cores
Graphics Memory64 GB LPDDR5
256-bit Memory Interface
up to 205 GB/s Memory Bandwidth
NetworkingNVIDIA® ConnectX®-7 SmartNIC
1x 100GbE Data Plane FP
1x 25GbE Data Plane UTP
1x 25GbE Control Plane UTP
Video Outputs1x DisplayPort™ (Optional Front Panel)
Storage64GB eMMC 5.1 Flash Storage. 8-bit
Up to 1TB NVMe (x1 PCIe Gen 4)
I/O1x USB2.0 (Optional Front Panel)
1x UART to Orin
1x UART to IPMI Controller
PCIePCIe Gen 4 x8 | x4x4 Interface to P1B Expansion Plane
Other Features2x NVDLA v2 Deep Learning Accelerators (1.6GHz)
NVENC Video Encoder (Up to 2x 4K60)
NVDEC Video Decoder (Up to 3x 4K60 / 1x 8K30)
Secure Boot
ProfilesSLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11-0
Operating Temperature (MIL-STD-810)-40°C to 85°C (Rugged Conduction Cooled)
Please refer to the Hardware User Guide for details on
temperature/ performance characterization.
Vibration (MIL-STD-810)0.1 g²/Hz
Shock (MIL-STD-810)40 g
Humidity (MIL-STD-810)95% Without Condensation
Weight2.696 lbs (1223.1 g)
Power ConsumptionModule: 40-80W
Board Total: < 110W

What are the benefits of using a System-on-Module (SoM)?